Note the problems in the use of TEC1 series cooling components

1, when using non-special equipment to test the device, under the working parameters, the temperature of the hot end must be lower than 80℃, (including changing the direction of the current cold end into the hot end). Under the condition that there is no heat dissipation at the hot end, the test is carried out instantly with power, that is, with hand touch cooling...

Product specifications, performance and use specifications for semiconductor refrigeration sheets

Product name: Semiconductor refrigeration sheet Model: TEC1-- Series According to the Hui Wen refrigerator parameter table TES1-- series including micro and multistage device packaging requirements: the outer packing box is a standard corrugated export carton, with foam inside