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Product specifications, performance and use specifications for semiconductor refrigeration sheets

Time: 2024-12-16 15:52:51

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Product name: Semiconductor refrigeration sheet Model: TEC1-- Series According to the Hui Wen refrigerator parameter table TES1-- series including micro and multistage device packaging requirements: the outer packing box is a standard corrugated export carton, with foam inside

Product name: semiconductor refrigeration sheet

Model: TEC1-- The series is listed according to the Huiwen refrigerator parameter table

TES1- series includes micro and multistage devices

Packing requirements: The outer packing box is a standard corrugated export carton, and the inner box is a rigid foam box (the number of different models varies).

The outer box size is 52×29×33cm

Mark head: Huiwen

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In addition, it can also design shipping marks according to different user requirements

Technical parameters and inspection requirements:

one Each shipment must be accompanied by an inspection report. Our inspection report certifies that the inspected goods are consistent with the parameters of the samples provided by the supplier.

2. The company's detailed inspection items are as follows:

(1) Appearance inspection, including:

a. Light defects: surface and edge defects and irregularities;

b. Minor defects: superficial defects;

c. Light defects: porcelain surface and wire stains;

d. Heavy defect: whether the connecting end of the refrigerating sheet of red and black wires lacks a black heat shrink tube;

e. Heavy defects: incomplete appearance, such as breakage or small cracks.

(2) Parameter and size inspection:

a. Ceramic size specifications: according to customer requirements, the model is consistent with the refrigerator parts parameter table;

b. Impedance specifications: same as above;

c. Load current specifications: at rated voltage, consistent with the parameter table;

d. Minimum cooling temperature: less than 74.6 ℃, working voltage: 12VDC, ambient temperature 30℃

f. Each uniform cold piece must be equipped with two leads, one red, one black, the length according to customer requirements. Lead position: cold side up, lead down.

3. The average quality level AQL of our products is 1.5.

At present, all the semiconductor coolers produced by Huiwen company adopt the anti-diffusion barrier layer technology of American companies, which is different from the hot hanging bismuth process of some domestic manufacturers. The main difference is that the process not only improves the consistency of the refrigerator parts, but also greatly improves the reliable performance of the refrigerator parts. The technical department of the company in the field of product reliability test, positive 18 seconds to 6 seconds 24 hours continuous impact, resistance value and the test before the same, the cold plate anti-corruption, electrical durability test has been greatly improved, therefore, Huiwen sold products in the user's correct installation, assembly and use conditions, its life is more than 5 years.

The correct installation and assembly methods are as follows:

1. One side of the cooling plate is installed with the heat sink, one side is installed to the cold system, and the flatness of the installation surface is not more than 0.03mm to remove burrs and dirt.

2. The refrigerant plate is in good contact with the heat sink and the cooling guide block, and the contact surface must be coated with a thin layer of thermal grease.

3. When fixing the cooling plate, it is necessary to make the force of the cooling plate uniform, and pay attention not to excessive, in order to prevent the ceramic fracturing.

The conditions for correct use are as follows:

1. The DC power supply voltage must not exceed the rated voltage, and the ripple coefficient of the power supply is less than 10%.

2. The current shall not exceed the rated current of the component.

3. When the refrigerant is working, the reverse voltage must not be passed instantaneously (must be 5 minutes later).

4. Do not let water into the refrigerant.

5. The ambient humidity should not exceed 80%.

6. The hot surface temperature of conventional components shall not exceed 80 degrees Celsius.


Product specifications, performance and use specifications for semiconductor refrigeration sheets
Product name: Semiconductor refrigeration sheet Model: TEC1-- Series According to the Hui Wen refrigerator parameter table TES1-- series including micro and multistage device packaging requirements: the outer packing box is a standard corrugated export carton, with foam inside
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Technical Support: Yunchuang Chengda        This site supports  IPv6

Customer Service Telephone Numbers:86-316-8327685

Customer Service Email:hwjn@huabeicooling.com

Address: Jingbei Road, Xianghe Environmental Protection Industrial Park, Hebei Province, China North side B-08-01

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TEL:86-316-8327685

E-MAIL:hwjn@huabeicooling.com

ADD:No. B-08-01, North side of Jingbei Road, Xianghe Environmental Protection Industrial Park, Hebei

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