Principle of semiconductor cooling

1. Semiconductor cooling principle: the particles of an N-type and P-type semiconductor are welded into a pair with metal connectors. When the DC current flows from the N pole to the P pole, the heat absorption phenomenon is generated on the 2.3 end, which is called the cold end and the heat release phenomenon is generated on the following 1.4 end, which is called the hot end. If the current direction is reversed, the cold and hot ends are converted to each other. Because a couple produces a small thermal effect (generally about IKcal/h), it will actually be tens. A thermopile of hundreds of electric pairs. Therefore, the cooling of semiconductor - an endothermic indication of heat release is the transfer of energy caused by the change of potential energy caused by the carrier (electron and hole) flowing through the node.

2. Semiconductor cooling process: Electrons start from the negative electrode through the metal sheet - flow to P point 4- to P type - and then flow to P point 3- node metal sheet - from node 2- to N type - and then back through node 1- to the metal sheet back to the positive terminal of the power supply. Since the left half is P-type, the conduction mode is a hole, and the direction of the hole flow is opposite to the direction of the electron flow, so the hole is the joint 3 metal sheet - the joint 4 metal sheet - to the negative terminal of the power supply. The energy of the hole in the node 4 metal is lower than that of the hole in the P-type. When the hole wants to reach the P-type from 3 under the action of the electric field, the energy must be increased and this part of the potential energy must be turned into the pad energy of the hole. Therefore, metal 1 at node 3 is cooled down, and when the hole flows to 4, the metal sheet releases excess potential energy and heat because of the hole energy in P-type, and the metal sheet at these 4 places is heated. The right half is N-type, which is connected with the metal sheet by free electrons, and the potential energy in the metal node 2 is lower than the potential energy of the N-type electron. When the free electrons act on the electric field and the electrons pass through the node 2 to reach the N-type, the pad energy must be increased. This part of potential energy can only be obtained from the metal sheet, and the metal sheet of the node 2 must be cooled down. When the electrons flow from the N-type to the node-1 metal sheet, the excess energy must be released because the electrons flow from the higher potential energy to the lower potential energy. It becomes heat energy and heats the metal sheet at node 1, which is the hot end.